3M
7000000267
3M™ Diamond Pad Conditioner A165, 4.25-in dia
Specifications
| Application | Advanced Node (Memory & Logic), CMP, Hard Disk Drive Manufacturing, Wafer Manufacturing |
|---|---|
| Brand | 3M™ |
| COO | United States |
| Long Description | 3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency. |
| Product Type | Industrial Supplies |
| Short Description | A165 ALT Dia Pad Cond, 4.25 IN |