3M
7100308276
3M TRIZACT PAD COND B25T-2910-5S2 4.25
Specifications
| Application | Advanced Node (Memory & Logic), CMP, Wafer Manufacturing |
|---|---|
| Brand | Trizact™ |
| COO | United States |
| Long Description | 3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance. |
| Product Type | Industrial Supplies |
| Short Description | 3M TRIZACT PAD COND B25T-2910-5S2 4.25 |