3M
7100326447
3M™ Diamond Pad Con C Series, C2120-S, 4in, 10 Each/Case
Specifications
| Application | Advanced Node (Memory & Logic), CMP, Wafer Manufacturing |
|---|---|
| Brand | 3M™ |
| COO | Taiwan |
| Long Description | 3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. It helps minimize wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance. |
| Product Type | Industrial Supplies |
| Short Description | Diamond Pad Con C Series C2120-S, 4in |