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IBC Member Market

3M

7100373796

3M™ Trizact™ CMP Pad MR888H1C-A, 29.5 inch diameter

Specifications

ApplicationAdvanced Node (Memory & Logic), CMP, Semiconductor Fabrication, Wafer Manufacturing
BrandTrizact™
COOUnited States
Long Description3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.
Product TypeIndustrial Supplies
Short DescriptionCMP PAD MR888H1C-A, 29.5 INCH DIAMETER