3M
7100377555
3M™ Trizact™ CMP Pad MR888H1C-W3-A, 30.5 INCH DIAMETER
Specifications
| Application | Advanced Node (Memory & Logic), CMP, Semiconductor Fabrication, Wafer Manufacturing |
|---|---|
| Brand | Trizact™ |
| COO | United States |
| Long Description | 3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime. |
| Product Type | Industrial Supplies |
| Short Description | CMP PAD MR888H1C-W3-A, 30.5 INCH DIAMETE |