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Devcon

14315

Devcon HP 250 Epoxy

Specifications

Long DescriptionHigh-performance, gap-filling thixotropic paste for structural bonding applications|Superior toughness, impact and chemical resistant|Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics|Excellent gap fill.|
Short DescriptionHP 250 Epoxy, 50 mL, Dev-Pak, Straw
Packing TypeDev-Pak
Physical FormSolid
MaterialThixotropic Paste
Adhesive Tensile Shear3,200 psi
ORS Nasco SKU Number230-14315
ClassificationAdhesives & Glues
Prop 65 Warning LabelY
UsageStructural Bonding
Nominal Width6 in
Chemical CompoundEpoxy
TypeAdhesive
ColorStraw
Prop 65 Warning MessageWARNING: This product can expose you to chemicals including 4-Methyl Imidazole, which is known to the State of California to cause cancer and Methanol which is know to the State of California to cause birth defects or reproductive harm. For more information go to www.P65Warnings.ca.gov
ResistanceChlorinated Solvents; Kerosene; Moisture; Water; Weather
Nominal Height3 1/4 in
ApplicationMulti-Purpose
Nominal Length7 1/4 in
Applicable MaterialsAluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
Nominal Tensile Strength3,200 psi
Prop 65 Warning RequiredY
Odor/ScentLow
Base TypeEpoxy
Country of OriginUS